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Dimensional Tolerances
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(dimensions are in inches)
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2005
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2006
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Feature
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Standard
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Special
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Standard
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Special
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Core Thicknesses Min.
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0.0019
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0.0019
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0.0019
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0.0019
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Aspect Ratio
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18:1
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25:1
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18:1
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27:1
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Drill Size Min. Through Hole
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0.006
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0.007
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0.0047
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0.004
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Drill Size Min. Blind/Buried**
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0.0047
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0.004
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0.004
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0.003
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Plated Hole Size Tolerance
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+/-0.002
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+/-0.0015
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+/-0.0015
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+/-0.001
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Trace Width Min. (I/L)
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0.003
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0.002
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0.0027
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0.002
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Air Gap Min. (I/L)
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0.003
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0.0027
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0.0027
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0.0023
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Trace Width Min. (O/L)
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0.004
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0.003
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0.003
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0.002
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Air Gap Min. (O/L)
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0.005
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0.005
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0.004
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0.004
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Via Pad Size Min. (O/L)
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drill + 0.008
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drill + 0.006
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drill + 0.008
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drill + 0.006
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Via Pad Size Min. (I/L)
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drill + 0.008
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drill + 0.006
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drill + 0.008
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drill + 0.006
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Via Anti-pad Min.
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drill + 0.016
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drill + 0.011
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drill + 0.014
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drill + 0.010
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Max Thickness (multi-layer)
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0.260
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0.354
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0.260
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0.354
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Layer Count Max.
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40
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48
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40
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48
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Board Size Max.
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24.8 X 39.4
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24.8 X 39.8
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24.8 X 45.7
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24.8 X 46.1
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Layer/Layer Registration
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0.002
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0.0015
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0.0015
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0.0012
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2005
|
2006
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Feature
|
Standard
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Special
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Standard
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Special
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Core Thicknesses Min.
|
0.0019
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0.0019
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0.0019
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0.0019
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Aspect Ratio
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0.75:1
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1:1
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0.8:1
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1:1
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Via Pad Size Min. (I/L)
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drill + 0.008
|
drill + 0.006
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drill + 0.008
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drill + 0.006
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Via Pad Size Min. (O/L)
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drill + 0.008
|
drill + 0.007
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drill + 0.008
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drill + 0.006
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Working Panel Size Max.
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24.0 X 20.0
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24.0 X 20.0
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26.0 X 28.3
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26.0 X 28.3
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Single-end Impedance
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+/- 7%
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+/- 4%
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+/- 7%
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+/- 3%
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Differential Impedance
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+/- 7%
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+/- 5%
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+/- 7%
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+/- 5%
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Controlled Depth Drill
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Yes
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Yes
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Yes
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Yes
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Buried Capacitance
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Yes
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Yes
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Yes
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Yes
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Std. Materials
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FR-4, Low Er FR-4, High Tg FR-4, FR-5, Megtron (Getek),
Polyimide, Modified Polyimide, BT Resin, ZBC-2000
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Special Materials
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Teflon, PPO
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Organic Coating/Bare Cu
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Entek CU-56A, 106A, Tamura
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SnPb Plating
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HASL, Fused SnPb, Selective Solder Strip
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Ni Plating
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Electroless, Electroplate
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Au Plating
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Electroless, Electroplate, Immersion
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Silver
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Immersion
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Tin
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Immersion
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New Technologies/Evaluation
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Compositech Material
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Lead-Free Solder
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