15:1 aspect ratio Thickness = 3.7 mm Smallest FHS = 0.25 mm |
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31:1 aspect ratio Thickness = 6.3 mm Smallest FHS = 0.20 mm |
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20:1 aspect ratio Thickness = 4 mm Smallest FHS = 0.20 mm |
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Production Design Rules Thickness: 6.3mm max Drill: 0.20mm BGA Pitch: < 0.8mm |
PCB Thickness = 6.3mm Drill = 0.20 ![]() |
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42 Layer Material: MEW 5775 (Megtron 6) 28 x 30 in Backdrill – from both sides 8 separate depths Manufactured: Honjo |
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Current Production 40 Layer Material: MEM 5775 (Megtron 6) 40 x 20 in Thickness: .310 in Aspect Ratio: 25:1 Backdrill 8 separate depths Both sides |
PTH Multi-Depth Backdrill | |||
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25 Layer Material: Polyimide 4x Lamination 4x Drilling 2x Laser Drilling Filled Via Filled Via with Plating |
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12 Layer + 12 Layer = 28 Layer |
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