15:1 aspect ratio
Thickness = 3.7 mm
Smallest FHS = 0.25 mm		 31:1 aspect ratio
Thickness = 6.3 mm
Smallest FHS = 0.20 mm
20:1 aspect ratio
Thickness = 4 mm
Smallest FHS = 0.20 mm
Production Design Rules
Thickness: 6.3mm max
Drill: 0.20mm
BGA Pitch: < 0.8mm		 PCB Thickness = 6.3mm
Drill = 0.20
 
42 Layer
Material: MEW 5775 (Megtron 6)
28 x 30 in
Backdrill – from both sides
8 separate depths
Manufactured: Honjo
   
Current Production
40 Layer
Material: MEM 5775 (Megtron 6)
40 x 20 in
Thickness: .310 in
Aspect Ratio: 25:1
Backdrill
8 separate depths
Both sides		 PTH Multi-Depth Backdrill
Lrg_Panel_2
25 Layer
Material: Polyimide
4x Lamination
4x Drilling
2x Laser Drilling
Filled Via
Filled Via with Plating
12 Layer + 12 Layer = 28 Layer

website: iluminada design