Yamamoto Dongguan Technical Roadmap
2010 2011
Standard PTH Design Production Proto Production Proto
Max Working Panel Size 508 x 610 610 x 711 508 x 610 610 x 762
Usable Area of Panel 496 x 584 584 x 686 496 x 584 584 x 686
Overall Board Thickness 3.2 6.0 5.0 8.0
Min. Core Thickness 0.10 0.05 0.05 0.04
Max. Layer Count 22 28 22 30
Min. Core Thickness (sig-sig) 0.10 0.05 0.05 0.04
Min. Drill Size (Through Hole) 0.25 0.20 0.20 0.15
Min. Drill Size (Blind/Buried) 0.15 0.10 0.15 0.10
Controlled Depth Drilling (Z-axis) OK OK OK OK
Backdrill (diameter) N/A N/A N/A N/A
Buried Capacitance Material N/A N/A N/A N/A
Aspect Ratio (FHS) 10:1 12:1 10:1 12:1
Trace Width/Space (IL) 0.10/0.10 0.08/0.08 0.08/0.08 0.07/0.07
Trace Width/Space (OL) 0.10/0.10 0.08/0.10 0.08/0.10 0.07/0.07
Min. Via Pad Size drill + 0.25 drill + 0.20 drill + 0.20 drill + 0.15
Min. Anti Pad Size drill + 0.25 drill + 0.25 drill + 0.25 drill + 0.20
Padless N/A N/A N/A N/A
Registration 0.05 0.03 0.03 0.03
Impedance Control (SE) +/- 10% +/- 7% +/- 10% +/- 7%
Impedance Control (DI) +/- 10% +/- 7% +/- 10% +/- 7%
PTH fill, Pad on Via OK OK OK OK
Sequential Lamination OK OK OK OK
Backdrill (std.) N/A N/A N/A N/A
Backdrill (via) N/A N/A N/A N/A
Buried/Blind Vias Mechanical & Laser Mechanical & Laser Mechanical & Laser Mechanical & Laser
2009 2010
Laser Via Design Production Proto Production Proto
HDI 1+N+1 1+1+N+1+1 1+N+1 1+1+N+1+1
Min. Laser Diameter 0.15 0.10 0.15 0.10
Max. Laser Diameter 0.20 0.15 0.20 0.15
Max. Laser Depth 0.10 0.13 0.10 0.13
Min. Laser Depth 0.05 0.05 0.05 0.05
Laser Via Aspect Ratio (depth:dia) 0.67:1 1.2:1 0.67:1 1.2:1
Laser Pad Size (IL) drill + 0.25 drill + 0.18 drill + 0.25 drill + 0.18
Laser Pad Size (OL) drill + 0.25 drill + 0.18 drill + 0.25 drill + 0.18
Max. Working Panel Size 508 x 500 610 x 508 508 x 500 610 x 508

Unit (mm) / tangency

website: iluminada design