Yamamoto Tokorozawa Technical Roadmap
2010 2011
Standard PTH Design Production Proto Production Proto
Max Working Panel Size 510 x 610 510 x 610 510 x 610 510 x 610
Usable Area of Panel 480 x 580 480 x 580 480 x 580 480 x 580
Overall Board Thickness 5.6 5.6 5.6 5.6
Min. Core Thickness 0.050 0.025 0.050 0.025
Max. Layer Count 34 36 36 38
Min. Core Thickness (sig-sig) 0.08 0.06 0.06 0.06
Min. Drill Size (Through Hole) 0.2 0.10 0.13 0.10
Min. Drill Size (Blind/Buried) 0.13 0.10 0.13 0.1
Controlled Depth Drilling (Z-axis) +/-0.15 +/-0.10 +/-0.15 +/-0.10
Backdrill (diameter) TH diameter + 0.20 TH diameter + 0.15 TH diameter + 0.15 TH diameter + 0.15
Buried Capacitance Material - - - -
Aspect Ratio (Drill Size) 16:1 18:1 18:1 20:1
Trace Width/Space (IL) 0.070/0.080 0.050/0.080 0.070/0.080 0.050/0.080
Trace Width/Space (OL) 0.080/0.110 0.070/0.100 0.070/0.080 0.050/0.080
Min. Via Pad Size drill + 0.20 drill + 0.15 drill + 0.20 drill + 0.15
Min. Anti Pad Size drill + 0.40 drill + 0.30 drill + 0.35 drill + 0.25
Padless Yes Yes Yes Yes
Registration 0.05 0.04 0.05 0.04
Impedance Control (SE) +/- 10% +/- 7% +/- 7% +/- 5%
Impedance Control (DI) +/- 7% +/- 5% +/- 7% +/- 5%
PTH fill, Pad on Via t2.4 – 0.25 drill t3.0 – 0.25 drill t3.0 – 0.25 drill t4.0 – 0.20 drill
Sequential Lamination 10L + 14L 18L + 18L 14L + 14L 18L + 18L
Buried/Blind Vias Mechanical & Laser Mechanical & Laser Mechanical & Laser Mechanical & Laser
2009 2010
Laser Via Design Production Proto Production Proto
HDI Type I, II, III Type I, II, III Type I, II, III Type I, II, III
Min. Laser Diameter 0.13 0.13 0.13 0.10
Max. Laser Diameter 0.28 0.28 0.28 0.28
Max. Laser Depth 0.06 0.08 0.06 0.08
Min. Laser Depth 0.04 0.03 0.04 0.03
Laser Via Aspect Ratio (depth:dia) 0.5:1 0.5:1 0.5:1 0.5:0.8
Laser Pad Size (IL) drill + 0.17 drill + 0.15 drill + 0.15 drill + 0.15
Laser Pad Size (OL) drill + 0.17 drill + 0.15 drill + 0.15 drill + 0.15
Max. Working Panel Size 510X403 510X403 510X403 510X403

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