
| Yamamoto Honjo Technical Roadmap | ||||
|---|---|---|---|---|
| 2010 | 2011 | |||
| Standard PTH Design | Production | Proto | Production | Proto |
| Max Working Panel Size | 660 x 1100 | 660 x 1100 | 660 x 1100 | 660 x 1100 |
| Usable Area of Panel | 620 x 1040 | 620 x 1040 | 620 x 1040 | 620 x 1040 |
| Overall Board Thickness | 8.0 | 11.0 | 8.0 | 11.0 |
| Min. Core Thickness | 0.06 | 0.04 | 0.06 | 0.04 |
| Max. Layer Count | 52 | 70 | 52 | 70 |
| Min. Core Thickness (sig-sig) | 0.06 | 0.04 | 0.06 | 0.04 |
| Min. Drill Size (Through Hole) | 0.12 | 0.10 | 0.12 | 0.10 |
| Min. Drill Size (Blind/Buried) | 0.10 | 0.075 | 0.10 | 0.075 |
| Controlled Depth Drilling (Z-axis) | 0.30 +/- 0.25 | 0.13 +/- 0.07 | 0.30 +/- 0.25 | 0.13 +/- 0.07 |
| Backdrill (diameter) | TH diameter + 0.15 | TH diameter + 0.10 | TH diameter + 0.15 | TH diameter + 0.10 |
| Buried Capacitance Material | 0.05 | 0.025 (non UL) | 0.05 | 0.025 (non UL) |
| Aspect Ratio (Drill Size) | 20:1 | 27:1 | 20:1 | 27:1 |
| Trace Width/Space (IL) | 0.050/0.070 | 0.040/0.060 | 0.050/0.070 | 0.040/0.060 |
| Trace Width/Space (OL) | 0.090/0.110 | 0.050/0.080 | 0.090/0.110 | 0.050/0.080 |
| Min. Via Pad Size | drill + 0.16 | drill + 0.10 | drill + 0.16 | drill + 0.10 |
| Min. Anti Pad Size | drill + 0.32 | drill + 0.15 | drill + 0.32 | drill + 0.15 |
| Padless | Yes | Yes | Yes | Yes |
| Registration | 0.05 | 0.03 | 0.05 | 0.03 |
| Impedance Control (SE) | +/- 7% | +/- 3% | +/- 7% | +/- 3% |
| Impedance Control (DI) | +/- 7% | +/- 5% | +/- 7% | +/- 5% |
| PTH fill, Pad on Via | t3.6 – 0.25 drill | t6.3 – 0.20 drill | t3.6 – 0.25 drill | t6.3 – 0.20 drill |
| Sequential Lamination | 18L + 18L | above prod level | 18L + 18L | above prod level |
| Buried/Blind Vias | Mechanical & Laser | Mechanical & Laser | Mechanical & Laser | Mechanical & Laser |
| 2009 | 2010 | |||
| Laser Via Design | Production | Proto | Production | Proto |
| HDI | Type I, II, III | Type I, II, III | Type I, II, III | Type I, II, III |
| Min. Laser Diameter | 0.10 | 0.10 | 0.10 | 0.10 |
| Max. Laser Diameter | 0.35 | 0.35 | 0.35 | 0.35 |
| Max. Laser Depth | 0.12 | 0.26 | 0.20 | 0.26 |
| Min. Laser Depth | 0.04 | 0.03 | 0.04 | 0.03 |
| Laser Via Aspect Ratio (depth:dia) | 0.70:1 | 0.75:1 | 0.75:1 | 0.75:1 |
| Laser Pad Size (IL) | drill + 0.15 | drill + 0.12 | drill + 0.15 | drill + 0.12 |
| Laser Pad Size (OL) | drill + 0.15 | drill + 0.12 | drill + 0.15 | drill + 0.12 |
| Max. Working Panel Size | 610 x 510 | 610 x 660 | 610 x 510 | 610 x 660 |
Unit (mm) / tangency
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